BB135-T vs BB181,335 feature comparison

BB135-T NXP Semiconductors

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BB181,335 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description R-PDSO-G2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00
Configuration SINGLE SINGLE
Diode Capacitance Ratio-Min 8.9 12
Diode Capacitance-Nom 19.25 pF 12.5 pF
Diode Element Material SILICON
Diode Type VARIABLE CAPACITANCE DIODE VARIABLE CAPACITANCE DIODE
Frequency Band ULTRA HIGH FREQUENCY
JESD-30 Code R-PDSO-G2
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Qualification Status Not Qualified
Reverse Current-Max 0.01 µA
Reverse Test Voltage 30 V
Surface Mount YES YES
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Variable Capacitance Diode Classification ABRUPT ABRUPT
Base Number Matches 3 1
Part Package Code SOD
Pin Count 2
Manufacturer Package Code SOD523
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Rep Pk Reverse Voltage-Max 30 V
Time@Peak Reflow Temperature-Max (s) 30

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Compare BB181,335 with alternatives