BQ24250RGET
vs
BQ24250YFFR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| Input Voltage-Max |
10.5 V
|
10.5 V
|
| Input Voltage-Min |
4.35 V
|
4.35 V
|
| JESD-30 Code |
S-PQCC-N24
|
R-XBGA-B30
|
| JESD-609 Code |
e4
|
e1
|
| Length |
4 mm
|
2.2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
24
|
30
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
BGA30,5X6,16
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.88 mm
|
0.375 mm
|
| Supply Current-Max (Isup) |
5 mA
|
5 mA
|
| Supply Voltage-Max (Vsup) |
10.5 V
|
10.5 V
|
| Supply Voltage-Min (Vsup) |
4.35 V
|
4.35 V
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Threshold Voltage-Nom |
+3.35V
|
+3.35V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
2.59 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BQ24250RGET with alternatives
Compare BQ24250YFFR with alternatives