BR24G02FVT-3AE2
vs
AT24C02CY6-MAHM-T
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
2.00 X 3.00 MM, 0.50 MM PITCH, GREEN, MO-229, UDFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.B.1
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ALSO AVAILABLE 1.6-1.7V AT 0.4MHZ
|
100 YEAR DATA RETENTION
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| Length |
4.4 mm
|
3 mm
|
| Memory Density |
2048 bit
|
2097152 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
262144 words
|
| Number of Words Code |
256
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Seated Height-Max |
1.2 mm
|
0.6 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
2 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
1
|
2
|
| Data Retention Time-Min |
|
100
|
| JESD-609 Code |
|
e4
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare BR24G02FVT-3AE2 with alternatives
Compare AT24C02CY6-MAHM-T with alternatives