BR24G16FJ-3GTE2
vs
M24C16-FDW6TP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
STMICROELECTRONICS
|
| Package Description |
SOP-8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
15 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
STMicroelectronics
|
| Additional Feature |
SEATED HGT CALCULATED
|
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
40
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
4000000 Write/Erase Cycles
|
| I2C Control Byte |
1010MMMR
|
1010DDDR
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4.4 mm
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
2KX8
|
| Output Characteristics |
3-STATE
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programming Voltage |
3 V
|
1.8 V
|
| Seated Height-Max |
1.65 mm
|
1.2 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000002 A
|
0.000001 A
|
| Supply Current-Max |
0.002 mA
|
0.001 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.6 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare BR24G16FJ-3GTE2 with alternatives
Compare M24C16-FDW6TP with alternatives