BR24S16FVT-WE2
vs
M24C16-RMN3TG/S
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
|
| Ihs Manufacturer |
ROHM CO LTD
|
|
| Part Package Code |
SOIC
|
|
| Package Description |
ROHS COMPLIANT, TSSOP-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| I2C Control Byte |
1010MMMR
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| Length |
4.4 mm
|
|
| Memory Density |
16384 bit
|
|
| Memory IC Type |
EEPROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
2048 words
|
|
| Number of Words Code |
2000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2KX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LSSOP
|
|
| Package Equivalence Code |
TSSOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
|
| Parallel/Serial |
SERIAL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.25 mm
|
|
| Serial Bus Type |
I2C
|
|
| Standby Current-Max |
0.000002 A
|
|
| Supply Current-Max |
0.002 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
|
|
|
|
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