BR25H080FJ-W vs 25LC080B-E/SNG feature comparison

BR25H080FJ-W ROHM Semiconductor

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25LC080B-E/SNG Microchip Technology Inc

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer ROHM CO LTD MICROCHIP TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 5 MHz 10 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Memory Density 8192 bit 8192 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1KX8 1KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Serial Bus Type SPI SPI
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.91 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Data Retention Time-Min 200
Endurance 1000000 Write/Erase Cycles
JESD-609 Code e3
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Seated Height-Max 1.75 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.006 mA
Terminal Finish Matte Tin (Sn)
Write Protection HARDWARE/SOFTWARE

Compare BR25H080FJ-W with alternatives

Compare 25LC080B-E/SNG with alternatives