BYV29X-600,127 vs MUR860P feature comparison

BYV29X-600,127 NXP Semiconductors

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MUR860P Micro Commercial Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Part Package Code TO-220 TO-220AC
Package Description PLASTIC, TO-220, FULL PACK-2 TO-220AC, 2 PIN
Pin Count 2 3
Manufacturer Package Code SOD113
Reach Compliance Code not_compliant unknown
HTS Code 8541.10.00.70
Factory Lead Time 4 Weeks
Application SOFT RECOVERY
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type RECTIFIER DIODE
Forward Voltage-Max (VF) 1.45 V
JESD-30 Code R-PSFM-T2
JESD-609 Code e3
Non-rep Pk Forward Current-Max 77 A
Number of Elements 1
Number of Phases 1
Number of Terminals 2
Operating Temperature-Max 150 °C
Output Current-Max 9 A
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 600 V
Reverse Recovery Time-Max 0.06 µs
Surface Mount NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 1
Pbfree Code Yes

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