BZV55-C39
vs
1N5256(DO-35)
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
O-LALF-W2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
130 Ω
|
|
| JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.4 W
|
0.417 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
39 V
|
30 V
|
| Reverse Current-Max |
0.05 µA
|
10 µA
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Temp Coeff-Max |
41.2 mV/°C
|
|
| Voltage Tol-Max |
5%
|
20%
|
| Working Test Current |
2 mA
|
4.2 mA
|
| Base Number Matches |
10
|
1
|
| Part Package Code |
|
DO-7
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| JEDEC-95 Code |
|
DO-204AA
|
|
|
|
Compare BZV55-C39 with alternatives
Compare 1N5256(DO-35) with alternatives