BZV55-C4V3,135 vs BZV55C4V3 feature comparison

BZV55-C4V3,135 NXP Semiconductors

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BZV55C4V3 Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code MELF DO-34
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LELF-N2
Pin Count 2 2
Manufacturer Package Code SOD80C CASE 362-03
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 90 Ω 90 Ω
JESD-30 Code O-LELF-R2 O-LELF-N2
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 4.3 V 4.3 V
Reverse Current-Max 3 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN TIN LEAD
Terminal Form WRAP AROUND NO LEAD
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 6.98%
Working Test Current 5 mA 5 mA
Base Number Matches 1 5

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Compare BZV55C4V3 with alternatives