BZV55C39 vs BZV55C39 feature comparison

BZV55C39 Motorola Mobility LLC

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BZV55C39 STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC STMICROELECTRONICS
Part Package Code DO-34
Package Description O-LELF-N2
Pin Count 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 130 Ω 130 Ω
JESD-30 Code O-LELF-N2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 39 V 39 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5.13% 5%
Working Test Current 2 mA 2.5 mA
Base Number Matches 5 1
Knee Impedance-Max 500 Ω
Operating Temperature-Min -55 °C
Reverse Current-Max 0.1 µA
Voltage Temp Coeff-Max 46.8 mV/°C

Compare BZV55C39 with alternatives

Compare BZV55C39 with alternatives