BZV55C39
vs
BZV55-C39,135
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
130 Ω
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.4 W
|
| Reference Voltage-Nom |
39 V
|
39 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
2 mA
|
2 mA
|
| Base Number Matches |
29
|
2
|
| Package Description |
|
O-LELF-R2
|
| Pin Count |
|
2
|
| Case Connection |
|
ISOLATED
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
O-LELF-R2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
ZENER
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
|
|
|
Compare BZV55C39 with alternatives
Compare BZV55-C39,135 with alternatives
-
BZV55-C39,135 vs BZV55-C39
-
BZV55-C39,135 vs 933699660115
-
BZV55-C39,135 vs BZV55C39TRL13
-
BZV55-C39,135 vs BZV55C39-G
-
BZV55-C39,135 vs BZV55C39-GT1
-
BZV55-C39,135 vs BZV55-C39135
-
BZV55-C39,135 vs BZV55-C39,115
-
BZV55-C39,135 vs BZV55C39TRL
-
BZV55-C39,135 vs BZV55C39-T1