BZV55C39TRL vs BZV55C39 feature comparison

BZV55C39TRL YAGEO Corporation

Buy Now Datasheet

BZV55C39 Sangdest Microelectronics (Nanjing) Co Ltd

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS SANGDEST MICROELECTRONICS (NANJING) CO LTD
Package Description O-LELF-R2 MELF-2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 39 V 39 V
Reverse Current-Max 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 41.2 mV/°C
Voltage Tol-Max 5% 5.13%
Working Test Current 2 mA 2.5 mA
Base Number Matches 2 4
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare BZV55C39TRL with alternatives

Compare BZV55C39 with alternatives