BZX55C6V8RA1 vs BZX79C6V8-AP feature comparison

BZX55C6V8RA1 Tak Cheong Electronics (Holdings) Co Ltd

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BZX79C6V8-AP Micro Commercial Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MICRO COMMERCIAL COMPONENTS
Part Package Code DO-204 DO-35
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICAL BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 8 Ω 15 Ω
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 250 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.8 V 6.8 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5.88% 5.88%
Working Test Current 5 mA 5 mA
Base Number Matches 1 1
Pbfree Code Yes
Forward Voltage-Max (VF) 0.9 V
JESD-609 Code e3
Knee Impedance-Max 80 Ω
Moisture Sensitivity Level 1
Reverse Current-Max 2 µA
Reverse Test Voltage 3 V
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 10

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