CA3306CD
vs
MP7686JD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
EXAR CORP
|
| Package Description |
DIP, DIP18,.3
|
0.300 INCH, CERAMIC, DIP-18
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
5.5 V
|
4.6 V
|
| Analog Input Voltage-Min |
-0.5 V
|
|
| Conversion Time-Max |
0.067 µs
|
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, RESISTANCE LADDER
|
| JESD-30 Code |
R-CDIP-T18
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.7812%
|
3.125%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
6
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
15 MHz
|
25 MHz
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
2
|
| Length |
|
23.11 mm
|
| Seated Height-Max |
|
5.08 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare CA3306CD with alternatives
Compare MP7686JD with alternatives