CBAS17PBFREE
vs
BAS17T/R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Date Of Intro |
2018-01-31
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
STABISTOR DIODE
|
STABISTOR DIODE
|
| Forward Voltage-Max (VF) |
0.96 V
|
0.96 V
|
| Forward Voltage-Min (VF) |
0.87 V
|
0.87 V
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Dissipation-Max |
0.35 W
|
0.25 W
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
3
|
| Part Package Code |
|
SOT-23
|
| Package Description |
|
PLASTIC PACKAGE-3
|
| Pin Count |
|
3
|
| JEDEC-95 Code |
|
TO-236AB
|
| Qualification Status |
|
Not Qualified
|
| Reverse Test Voltage |
|
4 V
|
|
|
|
Compare CBAS17PBFREE with alternatives
Compare BAS17T/R with alternatives