CD5537B
vs
CD5537B
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
| Package Description |
DIE-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
100 Ω
|
|
| JESD-30 Code |
S-XUUC-N1
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
1
|
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
UNCASED CHIP
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.5 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
17 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Position |
UPPER
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
1 mA
|
|
| Base Number Matches |
1
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CD5537B with alternatives
Compare CD5537B with alternatives