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CD74HC00EX vs TC74HC00AFN feature comparison

CD74HC00EX Harris Semiconductor

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TC74HC00AFN Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 27 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14
Pin Count 14
Additional Feature NOT AVAILABLE IN JAPAN
Length 8.65 mm
Propagation Delay (tpd) 95 ns
Seated Height-Max 1.75 mm
Width 3.9 mm

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