CDLL3827AE3
vs
1N3827AUR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, LL41, MELF-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Reference Voltage-Nom
5.6 V
5.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
45 mA
45 mA
Base Number Matches
1
5
Rohs Code
Factory Lead Time
14 Weeks
JESD-609 Code
e0
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare CDLL3827AE3 with alternatives
Compare 1N3827AUR-1 with alternatives