CDLL5313
vs
JANTX1N5313UR-1
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
DEFENSE LOGISTICS AGENCY
|
| Package Description |
HERMETIC SEALED, GLASS, LL41, MELF-2
|
HERMETIC SEALED PACKAGE-2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
21 Weeks
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
245000 Ω
|
|
| JEDEC-95 Code |
DO-213AB
|
DO-213AB
|
| JESD-30 Code |
O-LELF-R2
|
O-XELF-R2
|
| JESD-609 Code |
e0
|
|
| Limiting Voltage-Max |
2.75 V
|
2.75 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Regulation Current-Nom (Ireg) |
4.3 mA
|
4.3 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
3
|
1
|
| Reference Standard |
|
MIL-19500/463G
|
|
|
|
Compare CDLL5313 with alternatives
Compare JANTX1N5313UR-1 with alternatives