CDR32BP560BFSP
vs
CDR32BP560BFWSAB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
AVX CORP
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
, 1206
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.23.00.20
|
8532.24.00.20
|
| Additional Feature |
MIL-PRF-55681
|
|
| Capacitance |
0.000056 µF
|
0.000056 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
1.3 mm
|
1.3 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3.2 mm
|
3.2 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
No
|
Yes
|
| Negative Tolerance |
1%
|
1%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
BULK
|
BULK
|
| Positive Tolerance |
1%
|
1%
|
| Rated (DC) Voltage (URdc) |
100 V
|
100 V
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
BP
|
BP
|
| Temperature Coefficient |
30ppm/Cel ppm/°C
|
30ppm/Cel ppm/°C
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
22 Weeks
|
| Reference Standard |
|
MIL-PRF-55681/8
|
|
|
|
Compare CDR32BP560BFSP with alternatives
Compare CDR32BP560BFWSAB with alternatives