CDSFR101A-HF
vs
1SS355-H
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
COMCHIP TECHNOLOGY CO LTD
|
FORMOSA MICROSEMI CO LTD
|
| Package Description |
R-PBCC-N2
|
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
HIGH RELIABILITY, LOW LEAKAGE CURRENT
|
HIGH RELIABILITY
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
UNSPECIFIED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
|
| JESD-30 Code |
R-PBCC-N2
|
R-PDSO-G2
|
| JESD-609 Code |
e4
|
|
| Non-rep Pk Forward Current-Max |
1 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Max |
0.1 A
|
0.1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.33 W
|
0.225 W
|
| Rep Pk Reverse Voltage-Max |
90 V
|
90 V
|
| Reverse Current-Max |
0.05 µA
|
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Reverse Test Voltage |
75 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8541.10.00.70
|
|
|
|
Compare CDSFR101A-HF with alternatives
Compare 1SS355-H with alternatives