CL10B104KB8NNNC
vs
0603X7R104KT2AT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Unknown
|
Active
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
KYOCERA AVX COMPONENTS CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
SAMSUNG
|
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
CHIP
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8532.24.00.20
|
| Factory Lead Time |
|
20 Weeks
|
| Capacitance |
|
0.1 µF
|
| Capacitor Type |
|
CERAMIC CAPACITOR
|
| Dielectric Material |
|
CERAMIC
|
| Height |
|
0.89 mm
|
| JESD-609 Code |
|
e3
|
| Length |
|
1.6 mm
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Multilayer |
|
Yes
|
| Negative Tolerance |
|
10%
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Package Style |
|
SMT
|
| Packing Method |
|
TR, Embossed, 7 Inch
|
| Positive Tolerance |
|
10%
|
| Rated (DC) Voltage (URdc) |
|
50 V
|
| Size Code |
|
0603
|
| Surface Mount |
|
YES
|
| Temperature Characteristics Code |
|
X7R
|
| Temperature Coefficient |
|
15% ppm/°C
|
| Terminal Finish |
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
|
WRAPAROUND
|
| Width |
|
0.8 mm
|
|
|
|
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