CMPSH-3
vs
933876540135
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Part Package Code |
SOT-23
|
|
Manufacturer Package Code |
SOT-23
|
|
Base Number Matches |
6
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Ihs Manufacturer |
|
NXP SEMICONDUCTORS
|
Package Description |
|
O-LELF-R2
|
Pin Count |
|
2
|
Reach Compliance Code |
|
unknown
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.70
|
Application |
|
GENERAL PURPOSE
|
Case Connection |
|
ISOLATED
|
Configuration |
|
SINGLE
|
Diode Element Material |
|
SILICON
|
Diode Type |
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
|
0.8 V
|
JESD-30 Code |
|
O-LELF-R2
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Non-rep Pk Forward Current-Max |
|
5 A
|
Number of Elements |
|
1
|
Number of Phases |
|
1
|
Number of Terminals |
|
2
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-65 °C
|
Output Current-Max |
|
0.2 A
|
Package Body Material |
|
GLASS
|
Package Shape |
|
ROUND
|
Package Style |
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Reference Standard |
|
IEC-60134
|
Rep Pk Reverse Voltage-Max |
|
30 V
|
Reverse Current-Max |
|
2.3 µA
|
Reverse Test Voltage |
|
25 V
|
Surface Mount |
|
YES
|
Technology |
|
SCHOTTKY
|
Terminal Finish |
|
Tin (Sn)
|
Terminal Form |
|
WRAP AROUND
|
Terminal Position |
|
END
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 933876540135 with alternatives