CMX813P3
vs
CMX823E4
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MX COM INC
|
CML MICROCIRCUITS LTD
|
Part Package Code |
DIP
|
TSSOP
|
Package Description |
DIP,
|
TSSOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
Length |
19.685 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
1.2 mm
|
Supply Current-Max |
2 mA
|
3 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Telecom IC Type |
PAGING DECODER
|
PAGING DECODER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
6.375 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare CMX813P3 with alternatives
Compare CMX823E4 with alternatives