CY2X013LXI122T
vs
CY2XF24FLXCT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DLCC
|
LCC
|
| Package Description |
5 X 3.20 MM, LEAD FREE, CERAMIC, LCC-6
|
5 X 3.20 MM, LEAD FREE, CERAMIC, LCC-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CAN ALSO OPERATES AT 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| JESD-30 Code |
R-CDSO-N6
|
R-CQCC-N6
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Clock Frequency-Max |
122.88 MHz
|
690 MHz
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LSON
|
QCCN
|
| Package Equivalence Code |
SOLCC6,.12
|
SOLCC6,.12
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.3 mm
|
1.3 mm
|
| Supply Current-Max |
125 mA
|
150 mA
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL GOLD
|
NICKEL GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.2 mm
|
3.2 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Primary Clock/Crystal Frequency-Nom |
|
0.1 MHz
|
|
|
|
Compare CY2X013LXI122T with alternatives
Compare CY2XF24FLXCT with alternatives