CY62167DV30LL-55BVXIT
vs
TC55VEM416AXBN55
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
| Package Description |
8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48
|
8 X 11 MM, 0.75 MM PITCH, PLASTIC, TFBGA-48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| JESD-609 Code |
e1
|
|
| Length |
9.5 mm
|
11 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA48,6X8,30
|
BGA48,6X8,30
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Standby Current-Max |
0.00001 A
|
|
| Standby Voltage-Min |
1.5 V
|
1.5 V
|
| Supply Current-Max |
0.03 mA
|
0.035 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.75 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
48
|
|
|
|
Compare CY62167DV30LL-55BVXIT with alternatives
Compare TC55VEM416AXBN55 with alternatives