CY62177EV30LL-55BAXI vs AS3LC2M16-70BE feature comparison

CY62177EV30LL-55BAXI Cypress Semiconductor

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AS3LC2M16-70BE Alliance Semiconductor Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ALLIANCE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 8 X 9.50 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-48 TFBGA,
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns
Alternate Memory Width 8
I/O Type COMMON
JESD-30 Code R-PBGA-B48
JESD-609 Code e1
Length 9.5 mm
Memory Density 33554432 bit
Memory IC Type STANDARD SRAM
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.000017 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.7 V
Supply Voltage-Min (Vsup) 2.2 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm
Base Number Matches 2 1

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