CY7C1470V25-200BZI vs GS8641E36GF-300T feature comparison

CY7C1470V25-200BZI Cypress Semiconductor

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GS8641E36GF-300T GSI Technology

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description FBGA-165 BGA,
Pin Count 165 165
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 5.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX36 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 2.38 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.625 V 2.7 V
Supply Voltage-Min (Vsup) 2.375 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm
Base Number Matches 2 1

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