CY7C1474BV33-167BGC vs W2Z1M72SJ28BC feature comparison

CY7C1474BV33-167BGC Cypress Semiconductor

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W2Z1M72SJ28BC White Electronic Designs Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code BGA
Package Description 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 PLASTIC, BGA-209
Pin Count 209
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.4 ns 2.8 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM SRAM MODULE
Memory Width 72 72
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX72 1MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.96 mm 2.5 mm
Standby Voltage-Min 3.14 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 3.6 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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