CY7C1515JV18-300BZC vs GS8672D36BGE-300 feature comparison

CY7C1515JV18-300BZC Rochester Electronics LLC

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GS8672D36BGE-300 GSI Technology

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 LBGA, BGA165,11X15,40
Pin Count 165 165
Reach Compliance Code unknown compliant
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINE ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type QDR SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish NOT SPECIFIED
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 2 1
Rohs Code Yes
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Voltage-Min 1.7 V
Supply Current-Max 1.48 mA
Technology CMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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