CY7C261-45PC vs N82HS641AF feature comparison

CY7C261-45PC Cypress Semiconductor

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N82HS641AF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.75 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.1 mA 0.175 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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