CY7C279-55DC vs 5962-8606319QXX feature comparison

CY7C279-55DC Cypress Semiconductor

Buy Now Datasheet

5962-8606319QXX

Part not found

Search for 5962-8606319QXX
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-28
Pin Count 28
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.03 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 1

Compare CY7C279-55DC with alternatives