CYUSB4357-BZXC
vs
USB5807T/KD
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA-192
|
VQFN-100
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
Infineon
|
Microchip
|
Bus Compatibility |
I2C; SPI
|
I2C; SMBUS; SPI
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
Data Transfer Rate-Max |
1250 MBps
|
625 MBps
|
JESD-30 Code |
S-PBGA-B192
|
S-XQCC-N100
|
JESD-609 Code |
e1
|
e3
|
Length |
12 mm
|
12 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
192
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
LFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA192,14X14,32
|
LCC100,.47SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
1.45 mm
|
0.9 mm
|
Supply Current-Max |
750 mA
|
|
Supply Voltage-Max |
1.05 V
|
1.32 V
|
Supply Voltage-Min |
0.95 V
|
1.08 V
|
Supply Voltage-Nom |
1 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Matte Tin (Sn) - annealed
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.31.00.01
|
Date Of Intro |
|
2016-10-03
|
Screening Level |
|
TS 16949
|
|
|
|
Compare CYUSB4357-BZXC with alternatives
Compare USB5807T/KD with alternatives