D2516ECMDXGJD-U vs AS4C256M16D3L-12BCN feature comparison

D2516ECMDXGJD-U Kingston Technology Company

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AS4C256M16D3L-12BCN Alliance Memory Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer KINGSTON TECHNOLOGY COMPANY INC ALLIANCE MEMORY INC
Package Description BGA, TFBGA,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Factory Lead Time 10 Weeks
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 20 ns
Clock Frequency-Max (fCLK) 934 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm 13 mm
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR3L DRAM DDR3L DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 256MX16 256MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Refresh Cycles 8192
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Sequential Burst Length 4,8
Standby Current-Max 0.028 A
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 1.45 V 1.45 V
Supply Voltage-Min (Vsup) 1.283 V 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 9 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Alliance Memory
Additional Feature AUTO/SELF REFRESH
Moisture Sensitivity Level 3

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