DAC-08AQ-B vs DAC08HN feature comparison

DAC-08AQ-B AMD

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DAC08HN NXP Semiconductors

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
Converter Type D/A CONVERTER D/A CONVERTER
Input Bit Code BINARY BINARY, OFFSET BINARY
Input Format PARALLEL, 8 BITS PARALLEL, 8 BITS
JESD-30 Code R-CDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.43 mm 19.09 mm
Negative Supply Voltage-Nom -15 V -15 V
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.06 mm
Settling Time-Nom (tstl) 0.085 µs 0.07 µs
Supply Voltage-Nom 15 V 15 V
Surface Mount NO NO
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Analog Output Voltage-Max 18 V
Analog Output Voltage-Min -10 V
Moisture Sensitivity Level 1
Settling Time-Max

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