DAC7750IRHAR
vs
DAC7750IPWP
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
TSSOP
|
Package Description |
VQFN-40
|
HTSSOP-24
|
Pin Count |
40
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PQCC-N40
|
R-PDSO-G24
|
JESD-609 Code |
e4
|
e4
|
Length |
6 mm
|
7.8 mm
|
Linearity Error-Max (EL) |
0.08%
|
0.08%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HTSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Sample Rate |
0.04 MHz
|
0.04 MHz
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Settling Time-Max |
10 µs
|
10 µs
|
Settling Time-Nom (tstl) |
10 µs
|
10 µs
|
Supply Current-Max |
4 mA
|
4 mA
|
Supply Voltage-Nom |
24 V
|
24 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
6 mm
|
4.4 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare DAC7750IRHAR with alternatives
Compare DAC7750IPWP with alternatives