DAC8221FP
vs
5962-8967101LA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
DEFENSE LOGISTICS AGENCY
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
CERAMIC, DIP-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Output Voltage-Max |
15 V
|
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDIP-T24
|
R-XDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
30.45 mm
|
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0122%
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
NOT SPECIFIED
|
| Qualification Status |
COMMERCIAL
|
Qualified
|
| Seated Height-Max |
5.33 mm
|
5.08 mm
|
| Settling Time-Nom (tstl) |
0.45 µs
|
0.45 µs
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
3
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
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