DAC8812IBPW
vs
AD5543BRM
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
TSSOP-16
|
3 X 4.70 MM, MO-187AA, MSOP-8
|
Pin Count |
16
|
8
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Analog Devices
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PDSO-G16
|
S-PDSO-G8
|
JESD-609 Code |
e4
|
e0
|
Length |
5 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.0031%
|
0.0031%
|
Moisture Sensitivity Level |
2
|
1
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
2 MHz
|
|
Seated Height-Max |
1.2 mm
|
1.1 mm
|
Settling Time-Max |
0.5 µs
|
|
Settling Time-Nom (tstl) |
0.5 µs
|
0.5 µs
|
Supply Current-Max |
0.005 mA
|
0.01 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4.4 mm
|
3 mm
|
Base Number Matches |
5
|
4
|
Manufacturer Package Code |
|
RM-8
|
Technology |
|
CMOS
|
|
|
|
Compare DAC8812IBPW with alternatives
Compare AD5543BRM with alternatives