DAC8831IRGYR
vs
AD5542AR-REEL7
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
HVQCCN, LCC14/18,.14SQ,20
|
SOP, SOP14,.25
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
2.5 V
|
4.5 V
|
| Analog Output Voltage-Min |
-2.5 V
|
-2.5 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PQCC-N14
|
R-PDSO-G14
|
| Length |
3.5 mm
|
8.65 mm
|
| Linearity Error-Max (EL) |
0.0061%
|
0.0061%
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC14/18,.14SQ,20
|
SOP14,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Settling Time-Nom (tstl) |
1 µs
|
1 µs
|
| Supply Current-Max |
0.02 mA
|
1.1 mA
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare DAC8831IRGYR with alternatives
Compare AD5542AR-REEL7 with alternatives