DB151
vs
HDBL151G
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DB-1, DIP-4
|
|
| Pin Count |
4
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
|
| Breakdown Voltage-Min |
50 V
|
50 V
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
| JESD-30 Code |
R-PDIP-T4
|
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
|
| Output Current-Max |
1.5 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
| Reverse Current-Max |
10 µA
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
19
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
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