DDC316CGXGR
vs
DDC316CGXGT
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-64
|
PLASTIC, BGA-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Analog Input Voltage-Max |
5.25 V
|
5.25 V
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8 mm
|
8 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Analog In Channels |
16
|
16
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA64,8X8,32
|
BGA64,8X8,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.1 MHz
|
0.1 MHz
|
| Seated Height-Max |
1.45 mm
|
1.45 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
|
|
|