DG306BK
vs
HI1-306-7
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP14,.3
|
,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DPST
|
DPST
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
|
| Length |
19.43 mm
|
|
| Neg Supply Voltage-Max (Vsup) |
-18 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-5 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NO
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Off-state Isolation-Nom |
62 dB
|
60 dB
|
| On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
5 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
150 ns
|
150 ns
|
| Switch-on Time-Max |
250 ns
|
250 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare DG306BK with alternatives
Compare HI1-306-7 with alternatives