DHG10I600PA
vs
ST15150
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
IXYS CORP
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
Part Package Code |
TO-220AC
|
|
Package Description |
ROHS COMPLIANT, PLASTIC PACKAGE-2
|
LEAD FREE, PLASTIC PACKAGE-3/2
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
|
Additional Feature |
FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE
|
FREE WHEELING DIODE
|
Application |
FAST SOFT RECOVERY
|
GENERAL PURPOSE
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
TO-220AC
|
TO-220AC
|
JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
Non-rep Pk Forward Current-Max |
100 A
|
200 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
10 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
300 V
|
150 V
|
Reverse Recovery Time-Max |
0.035 µs
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
2
|
1
|
Forward Voltage-Max (VF) |
|
1.36 V
|
Reverse Current-Max |
|
200 µA
|
Technology |
|
SCHOTTKY
|
|
|
|
Compare DHG10I600PA with alternatives
Compare ST15150 with alternatives