DM2213T-15I
vs
DM2233T-12
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
RAMTRON INTERNATIONAL CORP
|
| Package Description |
TSOP, TSOP44,.36,32
|
TSOP, TSOP44,.36,32
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
15 ns
|
12 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
EDO DRAM
|
EDO DRAM
|
| Memory Width |
8
|
8
|
| Number of Terminals |
44
|
44
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX8
|
512KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
TSOP
|
| Package Equivalence Code |
TSOP44,.36,32
|
TSOP44,.36,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
1024
|
1024
|
| Standby Current-Max |
0.001 A
|
0.001 A
|
| Supply Current-Max |
0.18 mA
|
0.225 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TSOP2
|
| Pin Count |
|
44
|
| JESD-609 Code |
|
e0
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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