DM3730CUSD100
vs
CFA1170C
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
LSI CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
0.65 MM PITCH, GREEN, PLASTIC, FCBGA-423
|
,
|
| Pin Count |
423
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Address Bus Width |
26
|
16
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
54 MHz
|
|
| External Data Bus Width |
16
|
5
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B423
|
|
| JESD-609 Code |
e1
|
|
| Length |
16 mm
|
|
| Low Power Mode |
YES
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
128
|
|
| Number of Terminals |
423
|
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
90 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA423,24X24,25
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
16384
|
|
| Seated Height-Max |
1.4 mm
|
|
| Speed |
1000 MHz
|
|
| Supply Current-Max |
37 mA
|
|
| Supply Voltage-Max |
1.2 V
|
|
| Supply Voltage-Min |
1.08 V
|
|
| Supply Voltage-Nom |
1.14 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
16 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DM3730CUSD100 with alternatives
Compare CFA1170C with alternatives