DPSD128MX4WY5-DP-XX75
vs
K4H510438B-NLB00
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
TSOP2
|
TSOP2
|
Package Description |
ATSOP,
|
TSSOP,
|
Pin Count |
54
|
54
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
7.5 ns
|
0.75 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PDSO-G54
|
R-PDSO-G54
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
DDR1 DRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
54
|
54
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
128MX4
|
128MX4
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
ATSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, PIGGYBACK, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.59 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
11.2 mm
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Supply Voltage-Max (Vsup) |
|
2.7 V
|
Supply Voltage-Min (Vsup) |
|
2.3 V
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Width |
|
10.16 mm
|
|
|
|
Compare DPSD128MX4WY5-DP-XX75 with alternatives
Compare K4H510438B-NLB00 with alternatives