DS2501P-UNW vs DS2505P+ feature comparison

DS2501P-UNW Dallas Semiconductor

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DS2505P+ Maxim Integrated Products

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DALLAS SEMICONDUCTOR MAXIM INTEGRATED PRODUCTS INC
Package Description , SOC, SOC6,.17
Reach Compliance Code unknown compliant
Additional Feature MICROLAN COMPATIBLE MICROLAN COMPATIBLE
JESD-30 Code R-PDSO-C6 R-PDSO-C6
Memory Density 512 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 6 6
Number of Words 512 words 16384 words
Number of Words Code 512 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X1 16KX1
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2.8 V 2.8 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology MOS MOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form C BEND C BEND
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 6
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 15000 ns
I/O Type COMMON
JESD-609 Code e3
Length 3.94 mm
Moisture Sensitivity Level 1
Package Code SOC
Package Equivalence Code SOC6,.17
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.5 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.76 mm

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