DS2502P+ vs DS2502P feature comparison

DS2502P+ Maxim Integrated Products

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DS2502P Dallas Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC DALLAS SEMICONDUCTOR
Part Package Code SOIC
Package Description SOC, SOC6,.17 TSOC-6
Pin Count 6
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 15000 ns 15000 ns
Additional Feature MICROLAN COMPATIBLE MICROLAN COMPATIBLE
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-C6 R-PDSO-C6
JESD-609 Code e3 e0
Length 3.94 mm
Memory Density 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 6 6
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOC SOC
Package Equivalence Code SOC6,.17 SOC6,.17
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2.8 V 2.8 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form C BEND C BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.76 mm
Base Number Matches 2 2
Output Characteristics OPEN-DRAIN

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