DS2502X1
vs
DS2502R-01C+T&R
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
DALLAS SEMICONDUCTOR
|
MAXIM INTEGRATED PRODUCTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
15000 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B2
|
|
| JESD-609 Code |
e0
|
e3
|
| Memory Density |
1024 bit
|
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
|
| Number of Terminals |
2
|
|
| Number of Words |
128 words
|
|
| Number of Words Code |
128
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128X8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
FBGA
|
|
| Package Equivalence Code |
BGA2,1X2,37
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, FINE PITCH
|
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.95 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
,
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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