DS2505P-UNW
vs
DS2501C-UNW
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
Part Package Code |
SOIC
|
|
Package Description |
LSOC, SOC6,.17
|
,
|
Pin Count |
6
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Additional Feature |
MICROLAN COMPATIBLE
|
MICROLAN COMPATIBLE
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PDSO-C6
|
R-PDSO-C6
|
Length |
3.94 mm
|
|
Memory Density |
16384 bit
|
512 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Number of Words |
2048 words
|
64 words
|
Number of Words Code |
2000
|
64
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2KX8
|
64X8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSOC
|
|
Package Equivalence Code |
SOC6,.17
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.76 mm
|
|
Base Number Matches |
1
|
1
|
Output Characteristics |
|
OPEN-DRAIN
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare DS2505P-UNW with alternatives
Compare DS2501C-UNW with alternatives